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  • FrontcoverIssue III
  • Contents1
  • Feature
    • FeatureA hybrid approach to inverters3
    • FeatureCree readies GaN for low-cost markets4
    • FeatureUltra-high voltage devices for future power infrastructure5
    • FeaturePower amplifiers: Silicon CMOS will slowly weaken the vice-like grip of GaAs6
    • FeatureNew energy efficient motor technologies7
    • FeatureTemporary Bonding: Versatility is essential for high-efficiency power devices8
  • News Review
    • News ReviewSiC electronics power forward9
    • News ReviewCree plastic packaging slashes GaN RF transistor cost10
    • News ReviewABI: Wireless infrastructure drives RF power11
    • News ReviewSumitomo expands GaN-on-SiC capacity12
    • News ReviewMonolith and X-FAB to cut SiC power device cost13
    • News ReviewToshiba Expands Line-up of 650V SiC Schottky Barrier Diodes 14
    • News ReviewInfineon becomes fastest growing supplier for RF switches: One billion shipped15
    • News ReviewInfineon begins to reap reward of 300 millimetre technology development 16
    • News ReviewAlstom Board of Directors recommends General Electric’s offer17
    • News ReviewInfineon Has Shipped One Billion RF Switches For Smartphones And Tablets25
    • News ReviewIntel Lose Challenge Against €1.06 Billion Fine26
    • News ReviewGaN Systems Expansion Prompts Move To New R&D Facility27
  • New Products
    • New ProductsDiamond Microwave launches tiny GaN SSPA18
    • New ProductsON Semiconductor release single-chip CMOS device 19
    • New ProductsNew high power GaN amplifiers for Ka-band20
    • New ProductsIntersil updates power modules 21
    • New ProductsIR reveals power MOSFET for automotive applications22
    • New Products300mA CMOS-LDO Regulator ICs for Mobile Devices23
    • New ProductsMicrochip Announces New Family of USB Power Delivery Controllers24
    • New ProductsDiamond Microwave Launches Tiny GaN SSPA33
    • New ProductsTeledyne LeCroy Reveals HDV Probes For Power Electronics Measurements34
    • New ProductsIR Reveals Power MOSFET For Automotive Applications35
    • New ProductsAPI GaN power amplifiers beat TWTs36
  • Market Analysis
    • Market AnalysisHalving Energy Loss In Power Devices28
    • Market AnalysisMarket for Automotive Semiconductor Could Exceed $41B29
    • Market AnalysisWireless Infrastructure Drives RF Power30
    • Market AnalysisDespite Limited Revenue, Gan Power Industry Is Taking Shape31
    • Market AnalysisUCSB III-V MOSFET Could Rival Silicon FinFETs of Equal Size32

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